Gabriel Liske - Principal Engineer - Hahn-Schickard | XING
BW-CPS Gesamtprojekt Abschlussbericht
Virtueller Stammtisch: KI-ready – Schritt für Schritt zur digitalisierten Produktion Mittelstand-Digital Zentrum Fokus Mensch
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding - Document - Gale Academic OneFile
JMMP | Free Full-Text | Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
JMMP | Free Full-Text | An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
Peter WAPPLER | PhD | Master of Science | Institute for Micro Assembly Technology of the Hahn-Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies | Research profile
Peter WAPPLER | PhD | Master of Science | Institute for Micro Assembly Technology of the Hahn-Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies | Research profile
19. APRIL 2023
Peter Wappler - Wissenschaftlicher Mitarbeiter - Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | XING
Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | The International Journal of Advanced Manufacturing Technology
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
Romit K. on LinkedIn: Hahn-Schickard has a poster at the DLRK 2023 today. Do visit us and we…
applied sciences
9 Gründe für den Einsatz eines inline Düsen-Viskosimeters... - Innonet Kunststoff
Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | The International Journal of Advanced Manufacturing Technology
Substitution metallischer Gehäuse
BW-CPS Gesamtprojekt Abschlussbericht
Peter Wappler - Wissenschaftlicher Mitarbeiter - Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | XING
